Consumables
Universal BGA reballing kit contains reballing station with height adjustment and set of stencils.
ID: 818985
BGA ICs soldering paste (10 ml).
ID: 815437
Diameter: 0.6mm. Quantity: 250K.
ID: 815474
Diameter: 0.25mm. Quantity: 250K.
ID: 815484
Lead-Free BGA Balls, diameter: 0.3 mm, quantity: 250 000 pcs.
ID: 815483
Jovy Systems JV-RMP BGA rework stencils for Sony PlayStation 3 repair. Set includes RSX, CPU P2, CPU P3, A218 CXR713120, CXD9208GP, 06280W019, Si19132CBU.
ID: 820143
Protective reflexive tape for soldering (50 m).
ID: 815440
Diameter: 0.45mm. Quantity: 250K.
ID: 815467
High quality desoldering braid with unique no clean flux. Pure oxygen-free copper wire. Length: 1.5mm. Width: 2.0mm.
ID: 5909
Diameter: 0.25mm. Quantity: 250K.
ID: 815471
Diameter: 0.4mm. Quantity: 250K.
ID: 815468
Diameter: 0.5mm. Quantity: 250K.
ID: 815476
Diameter: 0.76mm. Quantity: 250K.
ID: 815472
Desoldering wick for solder removal, 2 mm x 1.5 m.
ID: 812807
Jovy Systems JV-RMX BGA rework stencils for XBox 360 repair. Set includes: X02047-012, GPU, CPU, HYB18HS12321AF-13.
ID: 820141
Diameter: 0.3mm. Quantity: 250K.
ID: 815470
Desoldering wick for solder removal, 2.5 mm x 20 m.
ID: 813225
Desoldering wick for solder removal, 1.5 mm x 1.5 m.
ID: 813226
Diameter: 0.35mm. Quantity: 250K.
ID: 815469
Diameter: 0.65mm. Quantity: 250K.
ID: 815473
Diameter: 0.55mm. Quantity: 250K.
ID: 815475
Diameter: 0.45mm. Quantity: 250K.
ID: 815477
Diameter: 0.65mm. Quantity: 250K.
ID: 815463
Diameter: 0.4mm. Quantity: 250K.
ID: 815478
The BGA gel flux with resin-like rheological properties. Excellent solderabillity, with minimal residue, and no need for cleaning.
ID: 817260
Re-balling base, 2 mm Allen key, mini spatula, 10 g solder paste, 3 stencils and user's guide.
ID: 814131
BGA gel flux (10 ml).
ID: 815435
Tin-lead BGA balls. Diameter: 0.6 mm. Quantity: 250 000.
ID: 817698
This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.
ID: 815443
Universal BGA Reballing Stencils Jovy Systems JV-RMS
ID: 820142
Jovy Systems JV-RKX reballing kit for XBox 360 repair. Kit includes X02047-012, GPU, CPU, HYB18HS12321AF-13 BGA stencils and Jovy Systems JV-JIG BGA reballing stand.
ID: 815444
Heat-resistant, high-temperature protective tape (30 m). Used for circuit boards and electronic components protection from high temperatures during the soldering process.
ID: 815441
Jovy Systems JV-RKS universal BGA reballing kit for repair of most of the IC types, pitch sizes, ball matrix and patterns. Kit includes 12 BGA stencils and reballing stand.
ID: 815442
Diameter: 0.5mm. Quantity: 250K.
ID: 817699
High quality desoldering braid made from oxygen free copper that has been treated with unique no clean flux.
ID: 821476
Diameter: 0,76mm. Quantity: 250K.
ID: 817697
Diameter: 0.55mm. Quantity: 250K.
ID: 815465
Cable Tie OP-1200L
ID: 5895
High quality desoldering braid made from oxygen free copper that has been treated with unique no clean flux.
ID: 821477
Protective reflexive tape for soldering (20 m).
ID: 815439
ID: 7341
Reflective adhesive tape that is used with Jovy Systems IR rework stations to reflect infrared rays and protect selected areas from excessive heating.
ID: 815438
Universal BGA rework stencil. Diameter 0.55mm. Pitch 1.0mm.
ID: 814255
Universal BGA rework stencil. Diameter 0.5mm. Pitch 0.8mm.
ID: 814254
Universal BGA rework stencil. Diameter 0.4mm. Pitch 0.8mm.
ID: 814252
Diameter: 0.35mm. Quantity: 250K.
ID: 815482
ID: 7342
Universal BGA rework stencil. Diameter 0.45mm. Pitch 0.8mm.
ID: 814253
BGA Stencil for Nokia X3/ X6/ N86
ID: 820799
Universal BGA rework stencil. Diameter 0.76mm. Pitch 1.27mm.
ID: 814257
