BGA stencils
Universal BGA Reballing Stencils Jovy Systems JV-RMS
ID: 820142
Jovy Systems JV-RMP BGA rework stencils for Sony PlayStation 3 repair. Set includes RSX, CPU P2, CPU P3, A218 CXR713120, CXD9208GP, 06280W019, Si19132CBU.
ID: 820143
Jovy Systems JV-RMX BGA rework stencils for XBox 360 repair. Set includes: X02047-012, GPU, CPU, HYB18HS12321AF-13.
ID: 820141
Universal BGA reballing kit contains reballing station with height adjustment and set of stencils.
ID: 818985
Re-balling base, 2 mm Allen key, mini spatula, 10 g solder paste, 3 stencils and user's guide.
ID: 814131
This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.
ID: 815443
Jovy Systems JV-RKX reballing kit for XBox 360 repair. Kit includes X02047-012, GPU, CPU, HYB18HS12321AF-13 BGA stencils and Jovy Systems JV-JIG BGA reballing stand.
ID: 815444
Jovy Systems JV-RKS universal BGA reballing kit for repair of most of the IC types, pitch sizes, ball matrix and patterns. Kit includes 12 BGA stencils and reballing stand.
ID: 815442
Universal BGA rework stencil. Diameter 0.55mm. Pitch 1.0mm.
ID: 814255
Universal BGA rework stencil. Diameter 0.5mm. Pitch 0.8mm.
ID: 814254
Universal BGA rework stencil. Diameter 0.4mm. Pitch 0.8mm.
ID: 814252
Universal BGA rework stencil. Diameter 0.45mm. Pitch 0.8mm.
ID: 814253
BGA Stencil for Nokia X3/ X6/ N86
ID: 820799
Universal BGA rework stencil. Diameter 0.76mm. Pitch 1.27mm.
ID: 814257
BGA stencil for soldering Nokia 5800/E71/E66/N81 (A183) ICs.
ID: 817332
Universal BGA rework stencil. Diameter 0.35mm. Pitch 0.6mm.
ID: 821198
ID: 8022
ID: 3599
ID: 820800
Universal BGA rework stencil. Diameter 0.35mm. Pitch 0.65mm.
ID: 814251
Universal BGA rework stencil. Diameter 0.3mm. Pitch 0.6mm.
ID: 821197
BGA stencil for soldering Nokia C6/N8/N900 ICs (27 in 1).
ID: 824032
Universal BGA rework stencil. Diameter 0.3mm. Pitch 0.5mm.
ID: 814250
Universal BGA rework stencil. Diameter 1.0mm. Pitch 1.5mm.
ID: 818396
ID: 7348
Universal BGA rework stencil. Diameter 0.65mm. Pitch 1.0mm.
ID: 815605
BGA Stencil for soldering Nokia N82/N85/N97 ICs.
ID: 822573
BGA stencil for soldering Samsung ICs (14 in 1).
ID: 820262
Universal BGA rework stencil. Diameter 0.6mm. Pitch 1.0mm.
ID: 814256
BGA stencil for soldering Nokia N70/ N72/ N73/ N95 ICs (38 in 1).
ID: 818714
BGA stencil for soldering Nokia N79/N96 ICs (58 in 1).
ID: 821183
Stencils for BGA rework.
ID: 905
BGA stencil for soldering Nokia N96 ICs.
ID: 818715
ID: 811278
BGA stencil for soldering Sony Ericsson ICs (17 in 1).
ID: 818324
ID: 7347
BGA stencil for soldering Nokia N78/ N79 /N85 /N96 /6500s /6600s ICs (25 in 1).
ID: 822879
BGA stencil for soldering K750/ K790/ K810/ K850/ W810/ W880 ICs (16 in 1, CPU+UEM+Flash).
ID: 822571
BGA stencil for soldering Nokia N79 ICs (25 in 1).
ID: 820808
ID: 3244
ID: 3245
ID: 7358
ID: 9048
ID: 8125
ID: 3250
BGA stencil kit for Nokia N70, Nokia N72, Nokia N73, Nokia N95
ID: 813559
Multipurpose BGA stencil 12 in 1
ID: 821182
ID: 7769
Bokar XURB-S set has an independent heating system, a Hot Plate XURB-H matching the reballing fixture. This heating method allows for reflow of reballed IC in approximately 2 minutes, which is 2 to 3 times faster and better than on any other heating system.
ID: 10440
ID: 7350
