Fluxes, BGA Solder Paste
The BGA gel flux with resin-like rheological properties. Excellent solderabillity, with minimal residue, and no need for cleaning.
ID: 817260
BGA ICs soldering paste (10 ml).
ID: 815437
BGA gel flux (10 ml).
ID: 815435
BGA ICs soldering paste (50 g), composition: Sn 63%, Pb 37%.
ID: 820278
