Consumables

ID: 815482
Diameter: 0.35mm. Quantity: 250K.
ID: 815473
Diameter: 0.65mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 46
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Out of stock
Availability in stock:
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USD 66
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Out of stock
ID: 828015
Desoldering wick for solder removal, 3 mm x 1.5 m.
ID: 814255
Universal BGA rework stencil. Diameter 0.55mm. Pitch 1.0mm.
Availability in stock:
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USD 4.8
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Availability in stock:
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USD 7
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Out of stock
ID: 817699
Diameter: 0.5mm. Quantity: 250K.
ID: 7343
Availability in stock:
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USD 41
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Availability in stock:
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USD 4.5
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Out of stock
ID: 815483
Lead-Free BGA Balls, diameter: 0.3 mm, quantity: 250 000 pcs.
ID: 828016
Desoldering wick for solder removal, 1.5 mm x 1.5 m.
Availability in stock:
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USD 55
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Availability in stock:
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USD 2.4
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Out of stock
ID: 843180
Tin-lead BGA balls. Diameter: 0.65 mm. Quantity: 250 000.
ID: 814256
Universal BGA rework stencil. Diameter 0.6mm. Pitch 1.0mm.
Availability in stock:
HKEUCN
USD 22
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Out of stock
Availability in stock:
HKEUCN
USD 7
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Out of stock
ID: 818396
Universal BGA rework stencil. Diameter 1.0mm. Pitch 1.5mm.
ID: 7441
Solder Wire (17 g). Wire diameter 0.8 mm.
Availability in stock:
HKEUCN
USD 7
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Out of stock
ID: 814131
Re-balling base, 2 mm Allen key, mini spatula, 10 g solder paste, 3 stencils and user's guide.
ID: 815484
Diameter: 0.25mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 80
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Availability in stock:
HKEUCN
USD 89
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Out of stock
ID: 833127
BGA stencil for soldering Apple iPhone 3G, iPhone 3GS, 12 in 1.
ID: 829715
Availability in stock:
HKEUCN
USD 1.94
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Out of stock
Availability in stock:
HKEUCN
USD 8
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Out of stock
ID: 843181
ID: 838244
Solder (63% Sn), diameter 0.8 mm, 100 g.
Availability in stock:
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USD 22
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Out of stock
ID: 841522
Polyethylene dispenser bottle for liquid, equipped with a pump and designed for holding up to 114 ml (4 oz) of liquid.
ID: 841523
Polyethylene dispenser bottle for liquid, equipped with a pump and designed for holding up to 227 ml (8 oz) of liquid.
ID: 818697
ID: 838248
Solder (63% Sn), diameter 0.6 mm, 500 g.
Availability in stock:
HKEUCN
Expected soon
ID: 850408
Tin-lead BGA balls. Diameter: 0.3 mm. Quantity: 250,000 pcs.
ID: 838249
Solder (63% Sn), diameter 1.2 mm, 500 g.
Availability in stock:
HKEUCN
Expected soon
ID: 838245
Solder (63% Sn), diameter 0.8 mm, 250 g.
ID: 838246
Solder (63% Sn), diameter 0.6 mm, 250 g.
ID: 832140
Solder Wire (17 g). Wire diameter 1.0 mm.
ID: 838247
Solder (63% Sn), diameter 0.8 mm, 500 g.
ID: 855889
VDE 1000V insulation tape, easy to tear off. Width: 20 mm. Length: 10 m.
ID: 818985
Universal BGA reballing kit contains reballing station with height adjustment and set of stencils.
Availability in stock:
HKEUCN
Product is discontinuedFind substitute

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