Reballing
All of the accessories and auxillary tools which are necessary for BGA reballing operations are presented in this category. Universal reballing kits, reballing stands, stencils, and other equipment are available in our online shop.
BGA reballing kit contains a reballing station and a set of stencils (0.8 mm, 0.76 mm, 0.6 mm, 0.5 mm, 0.45 mm).
ID: 830121
Heat-resistant, high-temperature protective tape (30 m). Used for circuit boards and electronic components protection from high temperatures during the soldering process.
ID: 815441
Jovy Systems JV-RMP BGA rework stencils for Sony PlayStation 3 repair. Set includes RSX, CPU P2, CPU P3, A218 CXR713120, CXD9208GP, 06280W019, Si19132CBU.
ID: 820143
Reflective adhesive tape that is used with Jovy Systems IR rework stations to reflect infrared rays and protect selected areas from excessive heating.
ID: 815438
Re-balling base, 2 mm Allen key, mini spatula, 10 g solder paste, 3 stencils and user's guide.
ID: 814131
This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.
ID: 815443
Jovy Systems JV-RKS universal BGA reballing kit for repair of most of the IC types, pitch sizes, ball matrix and patterns. Kit includes 12 BGA stencils and reballing stand.
ID: 815442





