Reballing

All of the accessories and auxillary tools which are necessary for BGA reballing operations are presented in this category. Universal reballing kits, reballing stands, stencils, and other equipment are available in our online shop.
BGA reballing kit contains a reballing station and a set of stencils (0.8 mm, 0.76 mm, 0.6 mm, 0.5 mm, 0.45 mm).
ID: 830121
Universal BGA Reballing Stencils Jovy Systems JV-RMS
ID: 820142
 
USD 130
 
USD 85
Heat-resistant, high-temperature protective tape (30 m). Used for circuit boards and electronic components protection from high temperatures during the soldering process.
ID: 815441
Reballing heat-proof stencils set.
ID: 830124
 
USD 33
 
USD 68
Jovy Systems JV-RMP BGA rework stencils for Sony PlayStation 3 repair. Set includes RSX, CPU P2, CPU P3, A218 CXR713120, CXD9208GP, 06280W019, Si19132CBU.
ID: 820143
Jovy Systems JV-RMX BGA rework stencils for XBox 360 repair. Set includes: X02047-012, GPU, CPU, HYB18HS12321AF-13.
ID: 820141
 
USD 63
 
USD 42
Reflective adhesive tape that is used with Jovy Systems IR rework stations to reflect infrared rays and protect selected areas from excessive heating.
ID: 815438
Universal BGA reballing kit contains reballing station with height adjustment and set of stencils.
ID: 818985
 
USD 12
 
Out of stock
USD 260
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Re-balling base, 2 mm Allen key, mini spatula, 10 g solder paste, 3 stencils and user's guide.
ID: 814131
Jovy Systems JV-JIG reballing stand with 4 IC holders, an adjustable hold-down screw for chips of various thickness and a slot for unused balls.
ID: 820140
 
Out of stock
USD 80
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Out of stock
USD 110
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This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.
ID: 815443
Jovy Systems JV-RKX reballing kit for XBox 360 repair. Kit includes X02047-012, GPU, CPU, HYB18HS12321AF-13 BGA stencils and Jovy Systems JV-JIG BGA reballing stand.
ID: 815444
 
Out of stock
USD 43
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Out of stock
USD 260
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Jovy Systems JV-RKS universal BGA reballing kit for repair of most of the IC types, pitch sizes, ball matrix and patterns. Kit includes 12 BGA stencils and reballing stand.
ID: 815442
Bokar XURB-S set has an independent heating system, a Hot Plate XURB-H matching the reballing fixture. This heating method allows for reflow of reballed IC in approximately 2 minutes, which is 2 to 3 times faster and better than on any other heating system.
ID: 10440
 
Out of stock
USD 319
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Out of stock
USD 849
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