Surface-mount technology equipment

Equipment for work with surface-mount technology (SMT) components which are the design standard for constructing electronic circuits where the components are mounted directly onto the surface of the printed circuit board (PCB).
A rework station using dark medium infrared technology for lead free PCB component soldering and desoldering. Interfaces through USB with RE Jovy Soft, PC software that helps monitor the rework process.
ID: 11600
ACHI IR-PRO-SC Infrared Soldering Station - all-purpose repair kit, designed specially for recovery of huge circuit plates such as motherboards.
ID: 820237
 
USD 1450
 
USD 1049
This infrared rework station combines pre-heater suitable for large areas, high powered top-heater, compatible lead free solder iron and uses three temperature sensors.
ID: 822620
Diameter: 0.6mm. Quantity: 250K.
ID: 815474
 
USD 1250
 
USD 61
Heat-resistant, high-temperature protective tape (30 m). Used for circuit boards and electronic components protection from high temperatures during the soldering process.
ID: 815441
Diameter: 0.25mm. Quantity: 250K.
ID: 815484
 
USD 33
 
USD 89
Welding station for reworking big BGA IC's: gaming consoles (Xbox 360, PS2, PS3, PSP, WII), PC motherboards and others.
ID: 818755
Lead-Free BGA Balls, diameter: 0.3 mm, quantity: 250 000 pcs.
ID: 815483
 
USD 290
 
USD 55
Diameter: 0.55mm. Quantity: 250K.
ID: 815465
Diameter: 0.45mm. Quantity: 250K.
ID: 815467
 
USD 32
 
USD 32
Diameter: 0.25mm. Quantity: 250K.
ID: 815471
Diameter: 0.5mm. Quantity: 250K.
ID: 815476
 
USD 71
 
USD 55
Diameter: 0.76mm. Quantity: 250K.
ID: 815472
Diameter: 0.3mm. Quantity: 250K.
ID: 815470
 
USD 73
 
USD 32
Reflective adhesive tape that is used with Jovy Systems IR rework stations to reflect infrared rays and protect selected areas from excessive heating.
ID: 815438
Diameter: 0.35mm. Quantity: 250K.
ID: 815482
 
USD 12
 
USD 46
Diameter: 0.35mm. Quantity: 250K.
ID: 815469
Diameter: 0.65mm. Quantity: 250K.
ID: 815473
 
USD 32
 
USD 25
Diameter: 0.55mm. Quantity: 250K.
ID: 815475
Diameter: 0.45mm. Quantity: 250K.
ID: 815477
 
USD 53
 
USD 49
Diameter: 0.65mm. Quantity: 250K.
ID: 815463
Diameter: 0.4mm. Quantity: 250K.
ID: 815478
 
USD 30
 
USD 55
Works together with the Jovy Systems RE-7500 infrared BGA rework station, circuit boards up to 350 mm × 450 mm.
ID: 815431
All-purpose repair kit, designed specially for recovery of huge circuit plates such as motherboards. Two lower preheaters.
ID: 831948
 
USD 142
 
USD 2150
Universal BGA reballing kit contains reballing station with height adjustment and set of stencils.
ID: 818985
All-purpose repair kit, designed specially for recovery of middle-sized circuit plates such as laptop motherboards.
ID: 822581
 
Out of stock
USD 260
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Out of stock
USD 850
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Re-balling base, 2 mm Allen key, mini spatula, 10 g solder paste, 3 stencils and user's guide.
ID: 814131
This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.
ID: 815443
 
Out of stock
USD 80
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Out of stock
USD 43
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Jovy Systems JV-RKX reballing kit for XBox 360 repair. Kit includes X02047-012, GPU, CPU, HYB18HS12321AF-13 BGA stencils and Jovy Systems JV-JIG BGA reballing stand.
ID: 815444
Jovy Systems JV-RKS universal BGA reballing kit for repair of most of the IC types, pitch sizes, ball matrix and patterns. Kit includes 12 BGA stencils and reballing stand.
ID: 815442
 
Out of stock
USD 260
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Out of stock
USD 319
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Diameter: 0.4mm. Quantity: 250K.
ID: 815468
A Unique, Modular, Digital PID Control SMT Rework/Repair System with integrated Pre-heater, which offers precise and accurate monitoring of process temperatures at a working point on a PCB.
ID: 10437
 
Out of stock
USD 32
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Out of stock
USD 4399
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3 in 1 Repairing System that combines the function of an infrared welding tool, a soldering iron and a pre-heater.
ID: 816731
This is a high quality SMT rework/repair system. It easily handles reworking of all SMDs from chips to BGAs.
ID: 811711
 
Out of stock
USD 1220
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Out of stock
USD 4195
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No need for nozzles. No air flow during re-flow process. No air flow in the course of BGA re-balling; Nearly 100% successful BGA re-balling.
ID: 817634
Hot air upper heater, hot air and infrared bottom heaters. Precise temperature control. Easy disassemblage.
ID: 830435
 
Out of stock
USD 7500
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Out of stock
USD 1220
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ERSA IR500A Infrared Soldering Station - functional and affordable equipment for work with components sized 10 to 55 mm, such as BGA chipsets and fine pitch QFPs.
ID: 821642
 
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