Universal BGA Reballing Kit Jovy Systems JV-RKS

USD 319

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Code: 815442
Weight: 0.700 kg

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Short review Jovy Systems JV-RKS. Jovy Systems JV-RKS universal BGA reballing kit for repair of most of the IC types, pitch sizes, ball matrix and patterns. Kit includes 12 BGA stencils and reballing stand.

Download additional information about Jovy Systems JV-RKS Universal BGA Reballing Kit.

Jovy Systems JV-RKS universal BGA reballing kit for repair of most of the IC types, pitch sizes, ball matrix and patterns. Kit includes 12 BGA stencils and reballing stand.

Warning! Do not use a solder paste for reballing purposes!

Features of Jovy Systems JV-RKS Universal BGA Reballing Kit

BGA stencils are made of stainless steel. Reballing Stand is made of aluminum.
Jovy Systems JV-JIG BGA Reballing Stand has 4 IC holders, an adjustable hold-down screw for chips of various thickness and a slot for unused balls. Compatible with Jovy Systems JV-RMX, JV-RMP and JV-RKC reballing sets.
Compatible with the upper preheater of Jovy Systems RE-7500 infrared BGA rework station and other soldering stations.

Technical Specifications of Jovy Systems JV-RKS Universal BGA Reballing Kit

Diameter	Thickness	Pitch	Number of holes	Ball pattern
0.76mm	0.25mm	1.50	900	30×30
0.76mm	0.25mm	1.27	900	30×30
0.76mm	0.25mm	1.27	1600	40×40
0.65mm	0.25mm	1.00	1600	40×40
0.65mm	0.25mm	1.00	900	30×30
0.65mm	0.25mm	1.00	400	20×20
0.45mm	0.25mm	0.80	900	30×30
0.45mm	0.25mm	0.80	400	20×20
0.40mm	0.20mm	0.70	900	30×30
0.30mm	0.20mm	0.60	900	30×30
0.30mm	0.20mm	0.50	900	30×30
0.25mm	0.15mm	0.50	900	30×30

Jovy Systems JV-RKS Universal BGA Reballing Kit – Package Content