Consumables

ID: 840086
Multi-functional BGA reballing kit with a convenient station for holding stencils with with height adjustment and a set of 56 BGA stencils.
ID: 817260
The BGA gel flux with resin-like rheological properties. Excellent solderabillity, with minimal residue, and no need for cleaning.
Availability in stock:
HKEUCN
USD 48
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Availability in stock:
HKEUCN
USD 32
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ID: 813225
Desoldering wick for solder removal, 2.5 mm x 20 m.
ID: 815437
BGA ICs soldering paste (10 ml).
Availability in stock:
HKEUCN
USD 19
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Availability in stock:
HKEUCN
USD 19
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ID: 813554
Thermal protective tape for soldering (16 mm).
ID: 812807
Desoldering wick for solder removal, 2 mm x 1.5 m.
Availability in stock:
HKEUCN
USD 3.4
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Availability in stock:
HKEUCN
USD 3.2
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ID: 855466
High quality desoldering wick (3.0 mm, 2 m) with braided copper wire, saturated with RMA flux.
ID: 820253
Soldering paste (10 g).
Availability in stock:
HKEUCN
USD 3.6
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Availability in stock:
HKEUCN
USD 3.2
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ID: 815435
BGA gel flux (10 ml).
ID: 846956
BGA stencil for soldering China-phone universal (CPU MTK), 35 in 1.
Availability in stock:
HKEUCN
USD 19
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Availability in stock:
HKEUCN
USD 1.9
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ID: 840148
BGA stencil for soldering HW26 (pitch 0.65 mm, pitch 0.6 mm, pitch 0.5 mm, pitch 0.8 mm, pitch 0,62 mm, pitch 0,75 mm, pitch 0,7 mm, pitch 0,3 mm, pitch 0,63 mm, pitch 0,55 mm, pitch 0,35 mm, pitch 0,2 mm, pitch 0,45 mm, pitch 0,85 mm, 27 in 1).
ID: 4135
Soldering flux (50 g).
Availability in stock:
HKEUCN
USD 2.78
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Availability in stock:
HKEUCN
USD 4.2
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ID: 846955
BGA stencil for soldering Apple iPhone 5C, 11 in 1.
ID: 859994
High quality desoldering wick (2.5 mm, 2 m) made of braided copper wire, saturated with RMA flux.
Availability in stock:
HKEUCN
USD 2.64
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Availability in stock:
HKEUCN
USD 3.2
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ID: 815439
Protective reflexive tape for soldering (20 m).
ID: 813226
Desoldering wick for solder removal, 1.5 mm x 1.5 m.
Availability in stock:
HKEUCN
USD 21
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Availability in stock:
HKEUCN
USD 3.5
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ID: 813553
Thermal protective tape for soldering (14 mm).
ID: 7787
Display protective tape avoids any scratches and damages mightl be caused during repair works
Availability in stock:
HKEUCN
USD 3.2
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Availability in stock:
HKEUCN
USD 14
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ID: 815441
Heat-resistant, high-temperature protective tape (30 m). Used for circuit boards and electronic components protection from high temperatures during the soldering process.
ID: 840150
BGA stencil for soldering China-phone universal Cell Phone, (49 in 1).
Availability in stock:
HKEUCN
USD 33
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Availability in stock:
HKEUCN
USD 2.54
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ID: 815438
Reflective adhesive tape that is used with Jovy Systems IR rework stations to reflect infrared rays and protect selected areas from excessive heating.
ID: 813552
Thermal protective tape for soldering (12 mm).
Availability in stock:
HKEUCN
USD 12
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Availability in stock:
HKEUCN
USD 3
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ID: 815467
Diameter: 0.45mm. Quantity: 250K.
ID: 846946
BGA stencil for soldering Apple iPhone 3G, iPhone 3GS, iPhone 4, 51 in 1.
Availability in stock:
HKEUCN
USD 32
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Availability in stock:
HKEUCN
USD 1.94
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ID: 820142
Universal BGA Reballing Stencils Jovy Systems JV-RMS
ID: 843177
Tin-lead BGA balls. Diameter: 0.5 mm. Quantity: 250 000.
Availability in stock:
HKEUCN
USD 77
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Availability in stock:
HKEUCN
USD 22
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ID: 846953
BGA stencil for soldering Samsung N9000 Note 3 Cell Phone, (21 in 1).
ID: 817698
Tin-lead BGA balls. Diameter: 0.6 mm. Quantity: 250 000.
Availability in stock:
HKEUCN
USD 2.21
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Availability in stock:
HKEUCN
USD 24
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ID: 815463
Diameter: 0.65mm. Quantity: 250K.
ID: 815470
Diameter: 0.3mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 30
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Availability in stock:
HKEUCN
USD 32
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ID: 820143
Jovy Systems JV-RMP BGA rework stencils for Sony PlayStation 3 repair. Set includes RSX, CPU P2, CPU P3, A218 CXR713120, CXD9208GP, 06280W019, Si19132CBU.
ID: 817697
Diameter: 0,76mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 43
Promotion:USD 35
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Availability in stock:
HKEUCN
USD 32
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ID: 815469
Diameter: 0.35mm. Quantity: 250K.
ID: 815477
Diameter: 0.45mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 32
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Availability in stock:
HKEUCN
USD 42
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ID: 820141
Jovy Systems JV-RMX BGA rework stencils for XBox 360 repair. Set includes: X02047-012, GPU, CPU, HYB18HS12321AF-13.
ID: 843173
Tin-lead BGA balls. Diameter: 0.25 mm. Quantity: 25 000.
Availability in stock:
HKEUCN
USD 42
Promotion:USD 31
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Availability in stock:
HKEUCN
USD 22
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ID: 815474
Diameter: 0.6mm. Quantity: 250K.
ID: 815468
Diameter: 0.4mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 57
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Availability in stock:
HKEUCN
USD 32
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ID: 815475
Diameter: 0.55mm. Quantity: 250K.
ID: 840928
BGA stencil for soldering Apple iPhone 5 Cell Phone, (20 in 1).
Availability in stock:
HKEUCN
USD 53
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Availability in stock:
HKEUCN
USD 2.62
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Out of stock
ID: 813551
Thermal protective tape for soldering (10 mm).
ID: 854814
BGA stencil for soldering Apple iPhone 6 Plus Cell Phone, (34 in 1).
Availability in stock:
HKEUCN
USD 2.8
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Out of stock
Availability in stock:
HKEUCN
USD 2.21
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Out of stock
ID: 829716
ID: 815440
Protective reflexive tape for soldering (50 m).
Availability in stock:
HKEUCN
USD 8.5
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Out of stock
Availability in stock:
HKEUCN
USD 22
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Out of stock
ID: 7786
Display protective tape avoids any scratches and damages mightl be caused during repair works
ID: 7228
Display protective tape avoids any scratches and damages mightl be caused during repair works
Availability in stock:
HKEUCN
USD 11
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Out of stock
Availability in stock:
HKEUCN
USD 4
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Out of stock
ID: 846954
BGA stencil for soldering Samsung I9300 Galaxy S3 Cell Phone, (18 in 1).
ID: 813550
Thermal protective tape for soldering (8 mm).
Availability in stock:
HKEUCN
USD 1.9
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Out of stock
Availability in stock:
HKEUCN
USD 2.4
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Out of stock
ID: 815465
Diameter: 0.55mm. Quantity: 250K.
ID: 838176
BGA stencil A00 for soldering HTC G1, G10, G11, G12, G13, G14, G15, G16, G17, G18, G2, G20, G21, G3, G4, G5, G6, G7, G8, G9, 39 in 1.
Availability in stock:
HKEUCN
USD 32
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Out of stock
Availability in stock:
HKEUCN
USD 2.62
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Out of stock

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