Consumables

ID: 838176
BGA stencil A00 for soldering HTC G1, G10, G11, G12, G13, G14, G15, G16, G17, G18, G2, G20, G21, G3, G4, G5, G6, G7, G8, G9, 39 in 1.
ID: 813549
Thermal protective tape for soldering (6 mm).
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USD 2.62
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USD 2
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ID: 820278
BGA ICs soldering paste (50 g), composition: Sn 63%, Pb 37%.
ID: 821477
High quality desoldering braid made from oxygen free copper that has been treated with unique no clean flux.
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USD 3.8
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ID: 5909
High quality desoldering braid with unique no clean flux. Pure oxygen-free copper wire. Length: 1.5 mm. Width: 2.0 mm.
ID: 7338
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USD 4.5
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ID: 4847
Not suitable for SMD and BGA soldering. Prevents from defects emergence. The paste has a good diffusion and non-corrosion properties.
ID: 836812
BGA stencil for soldering Nokia 1600, 5220c, 5800, C5-00, N79, X3-00, 51 in 1.
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USD 2.57
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ID: 831729
BGA stencil for soldering HTC G1, G10, G11, G12, G3, G4, G5, G6, G7, G8, G9, 20 in 1.
ID: 821476
High quality desoldering braid made from oxygen free copper that has been treated with unique no clean flux.
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USD 2.86
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ID: 830970
ID: 820799
BGA Stencil for Nokia X3/ X6/ N86
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USD 7
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USD 2
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ID: 7339
ID: 822879
BGA stencil for soldering Nokia N78/ N79 /N85 /N96 /6500s /6600s ICs (25 in 1).
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USD 4.5
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USD 2.5
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ID: 3599
BGA stencil for soldering Motorola L7, V3, V60, V600, V66, V70, Nokia 3220, 6030, 6230, 6630, 7210, 7610, 7650, 8310, 8800, N70, Samsung D500, Sony Ericsson K700, (CPU/FLASH/UEM), 74 in 1.
ID: 814257
Universal BGA rework stencil. Diameter 0.76mm. Pitch 1.27mm.
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USD 2.83
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USD 7
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ID: 843175
Tin-lead BGA balls. Diameter: 0.4 mm. Quantity: 250 000.
ID: 814250
Universal BGA rework stencil. Diameter 0.3mm. Pitch 0.5mm.
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USD 22
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USD 7
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ID: 815605
Universal BGA rework stencil. Diameter 0.65mm. Pitch 1.0mm.
ID: 815443
This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.
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USD 7
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USD 43
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ID: 815476
Diameter: 0.5mm. Quantity: 250K.
ID: 828011
Solder 0.4 mm in diameter (100 g), composition: Sn 97%, Ag 0.3%, Cu 0.7%, flux 2%.
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USD 52
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USD 7
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ID: 843176
Tin-lead BGA balls. Diameter: 0.45 mm. Quantity: 250 000.
ID: 814251
Universal BGA rework stencil. Diameter 0.35mm. Pitch 0.65mm.
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USD 22
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USD 7
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ID: 854813
BGA stencil for soldering Apple iPhone 6 Cell Phone, (29 in 1).
ID: 7340
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USD 1.9
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USD 4.5
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ID: 815444
Jovy Systems JV-RKX reballing kit for XBox 360 repair. Kit includes X02047-012, GPU, CPU, HYB18HS12321AF-13 BGA stencils and Jovy Systems JV-JIG BGA reballing stand.
ID: 821197
Universal BGA rework stencil. Diameter 0.3mm. Pitch 0.6mm.
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USD 160
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USD 6.5
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ID: 841715
BGA stencil A10 for soldering China-phone universal, 16 in 1.
ID: 846947
BGA stencil for soldering Apple iPhone 5S Cell Phone, (21 in 1).
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USD 2.5
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USD 2.47
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ID: 4846
Solder (100 g, 0.6 mm). Sn 62%, Pb 36%, Ag 2%
ID: 10440
Bokar XURB-S set has an independent heating system, a Hot Plate XURB-H matching the reballing fixture. This heating method allows for reflow of reballed IC in approximately 2 minutes, which is 2 to 3 times faster and better than on any other heating system.
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USD 849
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ID: 815471
Diameter: 0.25mm. Quantity: 250K.
ID: 828013
Solder 0.6 mm in diameter (100 g), composition: Sn 97%, Ag 0.3%, Cu 0.7%, flux 2%.
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USD 71
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USD 7
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ID: 814253
Universal BGA rework stencil. Diameter 0.45mm. Pitch 0.8mm.
ID: 7341
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USD 7
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USD 4.5
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ID: 821198
Universal BGA rework stencil. Diameter 0.35mm. Pitch 0.6mm.
ID: 843142
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USD 6.5
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USD 8.6
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ID: 815478
Diameter: 0.4mm. Quantity: 250K.
ID: 830971
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USD 55
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USD 5
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ID: 815472
Diameter: 0.76mm. Quantity: 250K.
ID: 828014
Desoldering wick for solder removal, 2.5 mm x 1.5 m.
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USD 63
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USD 4.8
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ID: 843178
Tin-lead BGA balls. Diameter: 0.55 mm. Quantity: 250 000.
ID: 814254
Universal BGA rework stencil. Diameter 0.5mm. Pitch 0.8mm.
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USD 22
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USD 7
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ID: 855465
High quality desoldering wick (2.0 mm, 2 m) with braided copper wire, saturated with RMA flux.
ID: 7342
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USD 3
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USD 4.5
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ID: 821461
Sn 63%, Pb 37% alloy for soldering under 320 – 360 °C. 1 mm wire diameter.
ID: 843172
Tin-lead BGA balls. Diameter: 0.3 mm. Quantity: 250 000.
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USD 22
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ID: 815482
Diameter: 0.35mm. Quantity: 250K.
ID: 815473
Diameter: 0.65mm. Quantity: 250K.
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USD 46
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Availability in stock:
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USD 66
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