Consumables

ID: 7228
Display protective tape avoids any scratches and damages mightl be caused during repair works
ID: 815465
Diameter: 0.55mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 4
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 32
Notify when in stock
Out of stock
ID: 813549
Thermal protective tape for soldering (6 mm).
ID: 820278
BGA ICs soldering paste (50 g), composition: Sn 63%, Pb 37%.
Availability in stock:
HKEUCN
USD 2
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 3.8
Notify when in stock
Out of stock
ID: 821477
High quality desoldering braid made from oxygen free copper that has been treated with unique no clean flux.
ID: 7338
Availability in stock:
HKEUCN
USD 4.5
Notify when in stock
Out of stock
ID: 7341
ID: 830970
Availability in stock:
HKEUCN
USD 4.5
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 7
Notify when in stock
Out of stock
ID: 836812
BGA stencil for soldering Nokia 1600, 5220c, 5800, C5-00, N79, X3-00, 51 in 1.
ID: 7339
Availability in stock:
HKEUCN
USD 2.57
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 4.5
Notify when in stock
Out of stock
ID: 855465
High quality desoldering wick (2.0 mm, 2 m) with braided copper wire, saturated with RMA flux.
ID: 4847
Not suitable for SMD and BGA soldering. Prevents from defects emergence. The paste has a good diffusion and non-corrosion properties.
Availability in stock:
HKEUCN
USD 3
Notify when in stock
Out of stock
ID: 5909
High quality desoldering braid with unique no clean flux. Pure oxygen-free copper wire. Length: 1.5 mm. Width: 2.0 mm.
ID: 821476
High quality desoldering braid made from oxygen free copper that has been treated with unique no clean flux.
ID: 843142
ID: 3599
BGA stencil for soldering Motorola L7, V3, V60, V600, V66, V70, Nokia 3220, 6030, 6230, 6630, 7210, 7610, 7650, 8310, 8800, N70, Samsung D500, Sony Ericsson K700, (CPU/FLASH/UEM), 74 in 1.
Availability in stock:
HKEUCN
USD 8.6
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 2.83
Notify when in stock
Out of stock
ID: 814257
Universal BGA rework stencil. Diameter 0.76mm. Pitch 1.27mm.
ID: 822879
BGA stencil for soldering Nokia N78/ N79 /N85 /N96 /6500s /6600s ICs (25 in 1).
Availability in stock:
HKEUCN
USD 7
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 2.5
Notify when in stock
Out of stock
ID: 843175
Tin-lead BGA balls. Diameter: 0.4 mm. Quantity: 250 000.
ID: 814250
Universal BGA rework stencil. Diameter 0.3mm. Pitch 0.5mm.
Availability in stock:
HKEUCN
USD 22
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 7
Notify when in stock
Out of stock
ID: 815605
Universal BGA rework stencil. Diameter 0.65mm. Pitch 1.0mm.
ID: 815443
This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.
Availability in stock:
HKEUCN
USD 7
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 43
Notify when in stock
Out of stock
ID: 820799
BGA Stencil for Nokia X3/ X6/ N86
ID: 815476
Diameter: 0.5mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 2
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 52
Notify when in stock
Out of stock
ID: 828011
Solder 0.4 mm in diameter (100 g), composition: Sn 97%, Ag 0.3%, Cu 0.7%, flux 2%.
ID: 843176
Tin-lead BGA balls. Diameter: 0.45 mm. Quantity: 250 000.
Availability in stock:
HKEUCN
USD 7
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 22
Notify when in stock
Out of stock
ID: 814251
Universal BGA rework stencil. Diameter 0.35mm. Pitch 0.65mm.
ID: 854813
BGA stencil for soldering Apple iPhone 6 Cell Phone, (29 in 1).
Availability in stock:
HKEUCN
USD 7
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 1.9
Notify when in stock
Out of stock
ID: 7340
ID: 815444
Jovy Systems JV-RKX reballing kit for XBox 360 repair. Kit includes X02047-012, GPU, CPU, HYB18HS12321AF-13 BGA stencils and Jovy Systems JV-JIG BGA reballing stand.
Availability in stock:
HKEUCN
USD 4.5
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 160
Notify when in stock
Out of stock
ID: 821197
Universal BGA rework stencil. Diameter 0.3mm. Pitch 0.6mm.
ID: 841715
BGA stencil A10 for soldering China-phone universal, 16 in 1.
Availability in stock:
HKEUCN
USD 6.5
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 2.5
Notify when in stock
Out of stock
ID: 846947
BGA stencil for soldering Apple iPhone 5S Cell Phone, (21 in 1).
ID: 4846
Solder (100 g, 0.6 mm). Sn 62%, Pb 36%, Ag 2%
Availability in stock:
HKEUCN
USD 2.47
Notify when in stock
Out of stock
ID: 10440
Bokar XURB-S set has an independent heating system, a Hot Plate XURB-H matching the reballing fixture. This heating method allows for reflow of reballed IC in approximately 2 minutes, which is 2 to 3 times faster and better than on any other heating system.
ID: 815471
Diameter: 0.25mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 849
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 71
Notify when in stock
Out of stock
ID: 828013
Solder 0.6 mm in diameter (100 g), composition: Sn 97%, Ag 0.3%, Cu 0.7%, flux 2%.
ID: 814253
Universal BGA rework stencil. Diameter 0.45mm. Pitch 0.8mm.
Availability in stock:
HKEUCN
USD 7
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 7
Notify when in stock
Out of stock
ID: 821198
Universal BGA rework stencil. Diameter 0.35mm. Pitch 0.6mm.
ID: 815478
Diameter: 0.4mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 6.5
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 55
Notify when in stock
Out of stock
ID: 830971
ID: 815472
Diameter: 0.76mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 5
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 63
Notify when in stock
Out of stock
ID: 828014
Desoldering wick for solder removal, 2.5 mm x 1.5 m.
ID: 843178
Tin-lead BGA balls. Diameter: 0.55 mm. Quantity: 250 000.
Availability in stock:
HKEUCN
USD 4.8
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 22
Notify when in stock
Out of stock
ID: 814254
Universal BGA rework stencil. Diameter 0.5mm. Pitch 0.8mm.
ID: 7342
Availability in stock:
HKEUCN
USD 7
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 4.5
Notify when in stock
Out of stock
ID: 821461
Sn 63%, Pb 37% alloy for soldering under 320 – 360 °C. 1 mm wire diameter.
ID: 843172
Tin-lead BGA balls. Diameter: 0.3 mm. Quantity: 250 000.
Availability in stock:
HKEUCN
USD 22
Notify when in stock
Out of stock
ID: 815482
Diameter: 0.35mm. Quantity: 250K.
ID: 815473
Diameter: 0.65mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 46
Notify when in stock
Out of stock
Availability in stock:
HKEUCN
USD 66
Notify when in stock
Out of stock

Sales chat
Hot news
Subscription to ToolBoom Newsletter
Currency: US dollar
Cart your cart is empty
 
ToolBoom Online Store does not sell the chosen item(s) in your country.