BGA ICs Soldering Paste JYD-50

id: 820278
BGA ICs Soldering Paste JYD-50
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Overview
Brand: Mechanic
BGA ICs soldering paste (50 g), composition: Sn 63%, Pb 37%.
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Description

JYD-50 BGA ICs Soldering Paste is paste for soldering BGA ICs (50 g).

JYD-50 BGA ICs Soldering Paste Technical Specifications

Composition Sn 63%, Pb 37%
Weight 50 g
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Description

JYD-50 BGA ICs Soldering Paste is paste for soldering BGA ICs (50 g).

JYD-50 BGA ICs Soldering Paste Technical Specifications

Composition Sn 63%, Pb 37%
Weight 50 g
Specifications
Weight
  • 35 g
Tin Content
  • Sn 63%
Lead Content
  • Pb 37%
Температура плавлення
  • 183 °C
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