BGA ICs Soldering Paste JYD-50
id: 820278
BGA ICs Soldering Paste JYD-50
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Overview
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Mechanic
BGA ICs soldering paste (50 g), composition: Sn 63%, Pb 37%.
Description
JYD-50 BGA ICs Soldering Paste is paste for soldering BGA ICs (50 g).
JYD-50 BGA ICs Soldering Paste Technical Specifications
| Composition | Sn 63%, Pb 37% |
| Weight | 50 g |
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Description
JYD-50 BGA ICs Soldering Paste is paste for soldering BGA ICs (50 g).
JYD-50 BGA ICs Soldering Paste Technical Specifications
| Composition | Sn 63%, Pb 37% |
| Weight | 50 g |
Specifications
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| Температура плавлення |
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