Bokar XURB-S set has an independent heating system, a Hot Plate XURB-H matching the reballing fixture. This heating method allows for reflow of reballed IC in approximately 2 minutes, which is 2 to 3 times faster and better than on any other heating system.
Specifically designed for XURB-S, the XURB-H unit has temperature controller with closed loop feedback, which guarantees proper heating rate and maximum temperature limit preventing reballed component damage; it also includes cooling fan, like no other unit in the industry to speed-up reballing time and make better quality solder balls.
Standard Bokar XURB-S System includes:
- XURB-H Heating Unit with XURB-CF cooling fan
- XURB-BF – Base with stencil holding frame. One universal frame holds the XURB-I insert specific for the IC body up to a size 40x40mm, and has one frame holding the stencil which is specific for balls pattern and size
- XURB-I-xyz – Insert specific for an IC body size (width, lengths, thickness).
- XURB-S-A-B-xy – Re-balling stencil matching the insert above where A is the number of balls, B - ball's pitch, and xy - IC body size.
- Micro Squeegee
- Tweezers
- 10cc Paste Flux Syringe
