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Catalog by RELIFE

Shown 9 out of 3093 results
RELIFE
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Soldering Paste RELIFE RL 420 UV 18 g
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Soldering Paste RELIFE RL-420-UV (18 g)
USD 1.50
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Light yellow solder paste for soldering and reballing BGA and PGA components on phone mainboards. No rinsing.
ID: 885615 0.1 kg
Soldering Paste RELIFE RL 421S OR 10 ml
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Soldering Paste RELIFE RL-421S-OR (10 ml)
USD 2.20
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High viscosity lead free solder paste designed for soldering and reballing SMD components and PCB. No residue.
ID: 885616 0.05 kg
Soldering Paste RELIFE RL 422S IM 10 ml
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Soldering Paste RELIFE RL-422S-IM (10 ml)
USD 2.30
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Strong active insulating flux paste for repairing mobile phones motherboards, CPU, etc. Lead-free and halogen-free. High insulation resistance.
ID: 885617 0.05 kg
Flux Paste RELIFE RL UV424 OR 10 ml
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Flux Paste RELIFE RL-UV424-OR (10 ml)
USD 3.00
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Gel-like acid-free flux paste without impurities. Used for electronic components soldering and reballing. Features strong activity and high insulation resistance.
ID: 885618 0.05 kg
Soldering Paste RELIFE RL 428 OR 100 g
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Soldering Paste RELIFE RL-428-OR (100 g)
USD 8.50
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Highly active halogen-free viscous soldering paste. Due to high insulation resistance, it can be used for PCB soldering and reballing.
ID: 885619 0.1 kg
Soldering Paste RELIFE RL 559 IM 100 g
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Soldering Paste RELIFE RL-559-IM (100 g)
USD 9.00
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Milky white soldering paste, not containing lead and halogens. Features high insulation resistance. It provides quick and high-quality tinning.
ID: 885620 0.1 kg
Solder Paste RELIFE RL 223 OR 100 g
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Solder Paste RELIFE RL-223-OR (100 g)
USD 9.00
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Lead-free highly active solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards. No residue.
ID: 885621 0.1 kg
Liquid Soldering Flux RELIFE RL 423 UV 10 ml
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Liquid Soldering Flux RELIFE RL-423-UV (10 ml)
USD 2.50
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Lead-free liquid flux for soldering and reballing BGA components. It can be used with infrared and rework stations.
ID: 885622 0.05 kg
Soldering Paste RELIFE RL UV425 OR 50 ml
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Soldering Paste RELIFE RL-UV425-OR (50 ml)
USD 5.00
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Gel-like acid-free flux paste without impurities. Used for electronic components soldering and reballing. Features strong activity and high insulation resistance.
ID: 901327 0.1 kg
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