Surface-mount technology equipment

Equipment for work with surface-mount technology (SMT) components which are the design standard for constructing electronic circuits where the components are mounted directly onto the surface of the printed circuit board (PCB).
ID: 841539
Multi-function semi-automatic infrared BGA rework system with PC synchronization and ceramic emitter for repairing PCBs of Xbox, PS3, laptops, PC motherboards, etc.
ID: 820237
ACHI IR-PRO-SC Infrared Soldering Station - all-purpose repair kit, designed specially for recovery of huge circuit plates such as motherboards.
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USD 790
Promotion:USD 580
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USD 1049
Promotion:USD 830
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ID: 815441
Heat-resistant, high-temperature protective tape (30 m). Used for circuit boards and electronic components protection from high temperatures during the soldering process.
ID: 815438
Reflective adhesive tape that is used with Jovy Systems IR rework stations to reflect infrared rays and protect selected areas from excessive heating.
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HKEUCN
USD 33
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USD 12
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ID: 815467
Diameter: 0.45mm. Quantity: 250K.
ID: 843177
Tin-lead BGA balls. Diameter: 0.5 mm. Quantity: 250 000.
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USD 32
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Availability in stock:
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USD 22
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ID: 815477
Diameter: 0.45mm. Quantity: 250K.
ID: 815463
Diameter: 0.65mm. Quantity: 250K.
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USD 42
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Availability in stock:
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USD 30
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ID: 817698
Tin-lead BGA balls. Diameter: 0.6 mm. Quantity: 250 000.
ID: 817697
Diameter: 0,76mm. Quantity: 250K.
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USD 24
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Availability in stock:
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USD 32
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ID: 843173
Tin-lead BGA balls. Diameter: 0.25 mm. Quantity: 25 000.
ID: 815474
Diameter: 0.6mm. Quantity: 250K.
Availability in stock:
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USD 22
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Availability in stock:
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USD 57
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ID: 815468
Diameter: 0.4mm. Quantity: 250K.
ID: 815475
Diameter: 0.55mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 32
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Availability in stock:
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USD 53
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ID: 815469
Diameter: 0.35mm. Quantity: 250K.
ID: 815470
Diameter: 0.3mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 32
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Availability in stock:
HKEUCN
USD 32
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ID: 818755
Soldering station for reworking big BGA IC's: gaming consoles (Xbox 360, PS2, PS3, PSP, WII), PC motherboards and others.
ID: 855864
Powerful rework station which combines infrared and hot air heating technologies. Suitable for reworking of SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and other components.
Availability in stock:
HKEUCN
USD 290
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Availability in stock:
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USD 1350
Promotion:USD 1199
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ID: 815465
Diameter: 0.55mm. Quantity: 250K.
ID: 7338
Availability in stock:
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USD 32
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Availability in stock:
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USD 4.5
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ID: 7339
ID: 815444
Jovy Systems JV-RKX reballing kit for XBox 360 repair. Kit includes X02047-012, GPU, CPU, HYB18HS12321AF-13 BGA stencils and Jovy Systems JV-JIG BGA reballing stand.
Availability in stock:
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USD 4.5
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Availability in stock:
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USD 160
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ID: 811711
This is a high quality SMT rework/repair system. It easily handles reworking of all SMDs from chips to BGAs.
ID: 815471
Diameter: 0.25mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 4195
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Availability in stock:
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USD 71
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ID: 843180
Tin-lead BGA balls. Diameter: 0.65 mm. Quantity: 250 000.
ID: 843174
Tin-lead BGA balls. Diameter: 0.35 mm. Quantity: 250 000.
Availability in stock:
HKEUCN
USD 22
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Availability in stock:
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USD 22
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ID: 815478
Diameter: 0.4mm. Quantity: 250K.
ID: 859519
All-purpose repair kit, designed specially for recovery of huge circuit plates such as motherboards of Sony PlayStation 3, Sony PlayStation 4, Xbox 360.
Availability in stock:
HKEUCN
USD 55
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Availability in stock:
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USD 830
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ID: 814131
Re-balling base, 2 mm Allen key, mini spatula, 10 g solder paste, 3 stencils and user's guide.
ID: 822581
All-purpose repair kit, designed specially for recovery of middle-sized circuit plates such as laptop motherboards.
Availability in stock:
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USD 80
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Availability in stock:
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USD 650
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ID: 815472
Diameter: 0.76mm. Quantity: 250K.
ID: 843181
Availability in stock:
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USD 63
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Availability in stock:
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USD 22
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ID: 7340
ID: 843175
Tin-lead BGA balls. Diameter: 0.4 mm. Quantity: 250 000.
Availability in stock:
HKEUCN
USD 4.5
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Availability in stock:
HKEUCN
USD 22
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ID: 815482
Diameter: 0.35mm. Quantity: 250K.
ID: 815431
Works together with the Jovy Systems RE-7500 infrared BGA rework station, circuit boards up to 350 mm × 450 mm.
Availability in stock:
HKEUCN
USD 46
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Availability in stock:
HKEUCN
USD 142
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ID: 822620
This infrared rework station combines pre-heater suitable for large areas, high powered top-heater, compatible lead free solder iron and uses three temperature sensors.
ID: 815473
Diameter: 0.65mm. Quantity: 250K.
Availability in stock:
HKEUCN
USD 980
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Availability in stock:
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USD 66
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ID: 7341
ID: 817699
Diameter: 0.5mm. Quantity: 250K.
Availability in stock:
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USD 4.5
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Availability in stock:
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USD 41
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ID: 843176
Tin-lead BGA balls. Diameter: 0.45 mm. Quantity: 250 000.
ID: 815483
Lead-Free BGA Balls, diameter: 0.3 mm, quantity: 250 000 pcs.
Availability in stock:
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USD 22
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Availability in stock:
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USD 55
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ID: 830435
Hot air upper heater, hot air and infrared bottom heaters. Precise temperature control. Easy disassemblage.
ID: 7342
Availability in stock:
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USD 1220
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Availability in stock:
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USD 4.5
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ID: 815484
Diameter: 0.25mm. Quantity: 250K.
ID: 859516
A rework station using dark medium infrared technology for lead free PCB component soldering and desoldering. Interfaces through USB with RE Jovy Soft, PC software that helps monitor the rework process.
Availability in stock:
HKEUCN
USD 89
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Availability in stock:
HKEUCN
USD 1130
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ID: 7343
ID: 843178
Tin-lead BGA balls. Diameter: 0.55 mm. Quantity: 250 000.
Availability in stock:
HKEUCN
USD 4.5
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Out of stock
Availability in stock:
HKEUCN
USD 22
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ID: 816731
3 in 1 Repairing System that combines the function of an infrared welding tool, a soldering iron and a pre-heater.
ID: 815443
This reballing kit includes 55 BGA stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.
Availability in stock:
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USD 1220
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Availability in stock:
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USD 43
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What Are Different SMD and BGA Rework Stations?

With each coming year, the amount of various electronics used in our day-to-day life increases. Obviously, all these electronic devices need constant maintenance and occasional repair. Perhaps the most difficult type of repair that is often encountered in electronics has something to do with PCBs - Printed Circuit Boards. Surface mount technology (SMT) method is widely used in producing modern circuit boards which are then called SMDs (surface-mount devices).

SMD development began in the second part of the 20th century and since then these devices were constantly gaining popularity. In contrast to the through-hole method, which uses wire leads to place and connect components into small holes on the circuit board, SMT method predicts placing the components directly on the board. SMT has many advantages over the through-hole method, such as, smaller size, high component density and lower cost, but some disadvantages as well, one of them being more a difficult repair process.  A special rework station is used for repairing these devices.

The two main parts of a typical SMD rework station are the heating element and the main block. Two different types of heating elements exist: hot gas and infrared. Both have some advantages and disadvantages over the other.

Infrared method uses infrared electromagnetic radiation to melt the solder and place/remove electrical components from the board. Hot gas method uses hot air or inert gas (such as nitrogen) to heat up the solder. Infrared SMD rework stations have a very easy setup and are quite simple to operate. They have no need for compressed air and, therefore, do not require different types of nozzles. They do, however, heat up the central areas more, have a less precise temperature control and may have different factors (such as surface shape) affect the surface temperature. Hot gas SMD rework stations, on the other hand, heat up the working area evenly and have a quite precise temperature control. They are a bit more difficult to operate as they require using nozzles of various sizes and shapes for different situations. Hot air SMD rework stations are a bit more common than infrared. However, a hybrid technology that combines both the hot air and the infrared method is also becoming quite popular.

One of the more popular types of surface-mount method is the ball grid array (BGA), which uses balls of solder placed in a grid pattern to conduct electrical signals between the PCB and the integrated circuit. BGA method has many advantages. It offers a high density of pins which is very useful for producing small packages for integrated circuits. BGA packages also have high heat conduction which prevents chip overheating, and low inductance that prevents occurring of signal distortions. Despite all of the advantages, there are quite a few disadvantages as well. Solder joints may fracture if affected by vibration, mechanical or thermal stress. These packages are also very difficult to inspect once they have been soldered into the PCB. Additional equipment, such as special microscopes or X-ray machines, is necessary to find faulty solder joints. This equipment is quite expensive, as well as the equipment necessary for soldering the BGA packages.

BGA rework stations are used for repairing and maintaining ball grid array packages. There are also two types of BGA rework stations: hot air and infrared. The two are quite simple in both the functionality and the list of advantages/disadvantages to their SMD counterparts. Hot air method was the first to be invented and, therefore, it is not surprising that for quite some time it was both more popular and common. The infrared method was invented later and although there is still a lot of effort that is being put into its development and improvement, it is quickly gaining popularity and is also becoming quite common.

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