Solder Paste RELIFE RL-223-OR (100 g)

id: 885621
0.1 kg
Availability in stock: HK
Lead-free highly active solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards. No residue.
USD 6.50
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Overview
Specifications
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Overview

RELIFE RL-223-OR is a lead free high quality solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.

Features

  • Lead free and no residue.
  • Features high viscosity and high activity.
  • Provides quick and high-quality tinning with a minimum amount of smoke.

Technical Specifications

Net weight 100 g
Package Dimensions 65 × 75 × 60 mm

Package Contents

  • Solder Paste RELIFE RL-223-OR (100 g) — 1 pc.
Specifications
Characteristics
  • high-level
Weight
  • 100 g
Intended Purpose
  • for lead-free soldering
Delivery
Payment
Warranty
Solder Paste RELIFE RL 223 OR 100 g  - Short description
Solder Paste RELIFE RL-223-OR (100 g)
USD 6.50
Add to cart

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