Solder Paste RELIFE RL-223-OR (100 g)
id: 885621
Solder Paste RELIFE RL-223-OR (100 g)
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USD 7.94
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Overview
0.1 kg
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HK
Lead-free highly active solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards. No residue. Read more
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Description
RELIFE RL-223-OR is a lead free high quality solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
Features
- Lead free and no residue.
- Features high viscosity and high activity.
- Provides quick and high-quality tinning with a minimum amount of smoke.
Technical Specifications
| Net weight | 100 g |
| Package Dimensions | 65 × 75 × 60 mm |
Package Contents
- Solder Paste RELIFE RL-223-OR (100 g) — 1 pc.
Specifications
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Delivery
Payment
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