Solder Paste RELIFE RL-223-OR (100 g)
id: 885621
Solder Paste RELIFE RL-223-OR (100 g)
Overview
Description
Specifications
Delivery
Payment
Warranty
USD 6.35
Overview
Bestseller
0.1 kg
Availability in stock:
HK
Lead-free highly active solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards. No residue. Read more
USD 6.35
Description
RELIFE RL-223-OR is a lead free high quality solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
Features
- Lead free and no residue.
- Features high viscosity and high activity.
- Provides quick and high-quality tinning with a minimum amount of smoke.
Technical Specifications
| Net weight | 100 g |
| Package Dimensions | 65 × 75 × 60 mm |
Package Contents
- Solder Paste RELIFE RL-223-OR (100 g) — 1 pc.
Specifications
| Characteristics |
|
| Weight |
|
| Intended Purpose |
|
Customers Feedback
Compare
No items in compare list
Compare
