Search "10 в 1" in category Soldering Equipment

An ESD-safe microprocessor controlled soldering station equipped with a fast acting ceramic heater suitable for advance lead-free soldering. Temperature Range 200 - 480 ºC.

Lead-free soldering station which operates in a wide temperature range from 200 to 480 °C at low voltage (24 V) with a large heat capacity (70 W).

Multifunction hot air soldering station combines hot air gun and soldering iron. Can be used to rework the full range of electronic components (DIP, SOIC, CHIP, QFP, BLCC etc).

3 in 1 Repairing System that combines the function of an Infrared welding tool, a soldering iron and a pre-heater.

All stations offer electronic temperature control, dial adjustable from 200°C to 480°C with +/- 15°C accurary.

“2 in 1” Portable soldering iron and flashlight ideal for quick repairing of circuit boards and electronic components.

3 in 1 multifunctional repairing system. Combines functions of a hot air gun, a soldering iron and a smoke absorber.

Hot Air Temperature: 100 - 300 °C; Hot Air Output Opening:58 X 58 mm; Dimensions: 413 (L) X 266 (W) X 90 (H) mm

AOYUE 6031 multifunctional station is a microprocessor-controlled ESD safe equipment for lead-free soldering and reworking.

CCD camera for real-time soldering process monitoring on PC screen.

For tablets and laptops you will need equipment such as IR BGA rework station, BGA reballing kit, thermal adhesive tape, BGA balls and a protective reflexive tape. We recommend the following models: Jovy Systems RE-8500 rework station, ACHI LP-56 BGA reballing kit, Jovy Systems JV-K030 adhesive tape, Jovy Systems JV-PB65 BGA balls and a Jovy Systems JV-R050 protective reflexive tape. When choosing these particular models you will get a 10% discount!

For smartphones repair you will need equipment such as infrared BGA rework station, LCD separator machine, gel flux, flux, glass separator wire and a soldering paste. We recommend the following models: Jovy Systems RE-7550 infrared BGA rework station, SM-252 LCD separator machine, Jovy Systems JV-F030 BGA gel flux and a Jovy Systems JV-SJ10 soldering paste. When choosing these particular models you will get a 10% discount!

Ceramic soldering iron with continuous temperature control within 100°C and 480°C. Power 70 W.

Hot air gun for soldering SMD components (QFP, SOP,BGA and PLCC). Turbine pump, automatic cooling. Temperature: 100°C – 480°C. Power consumption: 450 W.

Pro'sKit SS-601F hot air gun for soldering SMD components (QFP, SOP,BGA and PLCC). Temperature 100 to 480 °C. Power consumption 500 W. Turbine motor.

Jovy Systems JV-RKX reballing kit for XBox 360 repair. Kit includes X02047-012, GPU, CPU, HYB18HS12321AF-13 BGA stencils and Jovy Systems JV-JIG BGA reballing stand.

No need for nozzles. No air flow during re-flow process. No air flow in the course of BGA re-balling; Nearly 100% successful BGA re-balling.

All-purpose repair kit, designed specially for recovery of huge circuit plates such as motherboards. Two lower preheaters. Reballing accessories kit includes a reballing station, 10 BGA stencils, solder balls, etc.

Soldering and desoldering station built together for maximum performance

Digital infrared preheater offering radiation and airflow heating modes. Intelligent sleep mode, auto power off. Preheat time between 5 and 999 sec.

Hand held type hot air gun that simulates the purpose at a reflow oven. Uses Sirocco fan that provides seamless airflow on targeted device without disrupting it's adjacent components.

For electronics repair you will need equipment such as a hot air soldering station, infrared preheater, soldering paste, flux and soldering iron tips. We recommend: AOYUE 2702A+ hot air soldering station, Jovy Systems JV-SJ10 soldering paste, AOYUE Int 853A+ infrared preheater and a Jovy Systems JV-F030 gel flux. When choosing these particular models you will get a 10% discount!

Microprocessor-controlled hot air gun for soldering and desoldering of electronic components and plastic details. Power: 700 W. Temperature: 100-500 °C.

Lukey 863 platform is meant for printed board assembly heating for deformation avoidance when got air soldering. Is used for work with printed board assembly of mobile phones.